Samsung new 3D chip stacking RDIMM architecture
Samsung announces a 3D chip stacking RDIMM using a new architecture of a vertically holes instead of the horizontally architecture , the new RDIMM will be available next year:
Chipmaker Samsung has announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other.
The big idea is that the density of the memory by 50 per cent compared to conventional DIMM. It is all based on Samsung's Green DDR3 DRAM and 40 nanometer (nm)-sized technology.
The big idea is that the density of the memory by 50 per cent compared to conventional DIMM. It is all based on Samsung's Green DDR3 DRAM and 40 nanometer (nm)-sized technology.
Samsung new 3D chip stacking RDIMM architecture
Reviewed by Mhr
on
15:07
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Reviewed by Mhr
on
15:07
Rating:
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